Thermaltake Tg-30 Premium Cpugpu Heatsink Thermal Compound 4G Cl-O023-Grosgm-A
$16.05
Taxes will be calculated at Checkout.
US Delivery Time: 3-5 Business Days.
US Delivery Time: 3-5 Business Days.
Product Description
Thermaltake Tg-30 Premium Cpugpu Heatsink Thermal Compound 4G Cl-O023-Grosgm-A
Designed to lower cPU temperatures effectively, Tg-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the Tg-30As honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all cPUs.PN: cL-O023-gROSgM-ATHERMAL cONDUcTIVITY: 4.5 Wm-kcOLOR: grayWEIgHT: 4gVIScOSITY: 76 Pa-sTHERMAL IMPEDANcE: 0.185Ac -in WDENSITY: 2.55 gcmFeatures of Thermaltake Tg-30 Premium Cpugpu Heatsink Thermal Compound 4G Cl-O023-Grosgm-A
Performance compound] contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 Wm-k. All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware. Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered cPU. Sustainability and Safety] The Tg-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or crackingSpecification of Thermaltake Tg-30 Premium Cpugpu Heatsink Thermal Compound 4G Cl-O023-Grosgm-A
| Product Details | |
|---|---|
| Dimensions | 1X1X1 |
| Weight | 1 |
Warning - California Proposition 65 This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.